DENSO Signs Joint Development Agreement with MediaTek for Automotive SoC

KARIYA, Japan(December 26,2025)－ DENSO CORPORATION (hereinafter “DENSO”) announced that on October 31, 2025, it signed a joint development agreement with MediaTek Inc. (hereinafter “MediaTek”), a leading semiconductor design company, to accelerate the development of next-generation automotive system-on-chips (SoCs).

As automotive systems become increasingly intelligent and spur advancements in autonomous driving and vehicle connectivity, the importance of automotive SoCs as high-performance computing platforms capable of executing complex processing tasks continues to grow.

Leveraging its decades of expertise in automotive semiconductors, electronics component and automotive systems, DENSO develops SoCs optimized for automotive systems, ensuring real-time responsiveness, functional safety, and superior power efficiency.

Under this agreement, DENSO will develop system requirements for Automotive SoCs, considering effective and robust system behavior across various driving scenarios, and will design the fundamental architecture. MediaTek will utilize its proven SoC development capabilities to handle detailed design and verification based on DENSO’s requirements and architecture.

By combining DENSO’s system-level design capabilities with MediaTek’s semiconductor design expertise, the two companies aim to create a custom SoC tailored to DENSO’s vision. The SoC under development will be designed for integrated mobility computers that control in-vehicle systems.

DENSO will continue to innovate automotive semiconductor technologies, leveraging various solutions, to support the evolution of mobility and contribute to the development of a smarter mobility society.